Investigation of Materials for Inert Electrodes in Aluminum Electrodeposition Cells
Read Online
Share

Investigation of Materials for Inert Electrodes in Aluminum Electrodeposition Cells Topical Report for the Period December 6, 1982-December 5, 1985 by J. Haggerty

  • 262 Want to read
  • ·
  • 76 Currently reading

Published by U.S. Dept. of Energy, Idaho .
Written in English


Book details:

Edition Notes

StatementHaggerty, J.
ContributionsSadoway, D.R.
The Physical Object
Pagination67 p. $0.00 C.1.
Number of Pages67
ID Numbers
Open LibraryOL17586174M

Download Investigation of Materials for Inert Electrodes in Aluminum Electrodeposition Cells

PDF EPUB FB2 MOBI RTF

Electrodeposition of aluminium foils on carbon electrodes in low temperature ionic liquid†. Xianneng Tu ab, Junling Zhang b, Meng Zhang * a, Yingjun Cai b, Haiyan Lang b, Guoxin Tian a and Yanli Wang a a Harbin Engineering University, Harbin , P. R. China. E-mail: [email protected] b Beijing Key Laboratory of Ionic Liquids Clean Process, Key Laboratory of Green Process and Cited by: 6. USA USA USA USA US A US A US A US A US A US A US A US A US A US A US A US A Authority US United States Prior art keywords aluminum bath pyridinium chloride electrodeposition Prior art date Legal status (The legal status is an assumption Cited by: The electrodeposition and surface morphology of aluminium on tungsten (W) and aluminium (Al) electrodes from 2: 1 molar ratio AlCl3–[EMIm]Cl ionic liquids were investigated.   The cell corresponds to the setup already described. Working and counter electrodes were both × cm aluminium sheets thus avoiding electrolyte consumption during the electrodeposition. Following each electrodeposition, the obtained samples were washed in an acetonitrile solution.

  This compilation is the most comprehensive historical collection of papers written on primary aluminum science and technology. It is a definitive reference in the field of aluminum production and related light metals technologies and contains a strong mix of materials science and practical, applied technology. M. Nowicki, K. Wandelt, in Encyclopedia of Interfacial Chemistry, Metal Underpotential Deposition. The process of electrodeposition of metals, galvanization and electroplating, is an important industrial ch as the amounts and structures of electrochemically deposited metals become smaller and smaller, as for instance for the on-chip wiring in modern mass-production of logic. The other cell contains a deareated Pt solution (1 mM K 2 PtCl 4 + 50 mM H 2 SO 4). These two cells are connected with a secondary compartment made of Teflon and glass. The two cells and secondary compartment comprise a closed system. The volume above the solutions and inside the secondary compartment is filled with inert (O 2 free).   Electrodeposition technique was used successfully to synthesize nanostructured electrodes of ZnxCd 1-x (O) on ITO glass substrate with several values of x in an aqueous medium containing Zn 2+ and Cd 2+ species for energy generating photovoltaic cell, and the efficiency achieved was %. Electrodeposition of materials has the potential to.

electrodeposition processes for thin and thick resists, we will keep in mind that the materials that are deposited into these lithographic molds may have very different deposition characteristics.   Fig. 1 illustrates the basic electrochemical processes in the vicinity of a metal electrode during electrodeposition. In the electrolyte, metal ions M z+ transport toward the electrode. Upon arrival on the metal electrode, M z+ ions are reduced by reacting with electrons. The deposited atoms are not pinned at the original sites where the reactions occur; instead, surface atoms can diffuse on. Electrochemical deposition processes are commonly carried out in an electrochemical cell such as the one schematized in Figure The simplest electrochemical cell consists of a working electrode and a counter electrode, both of which are good electronic conductors and resistant to corrosion; these electrodes are separated by an ionic conductor or electrolyte. Electrodeposition of Ge at inert electrode substrates decorated with small .